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1.Recommended temperature

profile

The temperature profiles are based on the above conditions.

In individual applications the actual temperature may vary,depending on solder paste type,

volume/thickness and board size/thickness. Consult your solder paste and equipment

manufacturer for specific recommendations.

2.Recommended manual soldering

Manual soldering: 350ç ± 10ç for 3 seconds

3.Recommended screen thickness and

open area ratio (Pattern area ratio)

Thickness: 0.1 mm

Open area ratio: 100%

4.Board warpage

Maximum of 0.02mm at the connector center, with both ends of the connector as reference points.

5.Cleaning conditions

Cleaning is not recommended. When cleaning, please evaluate as if can deteriorate the

performance including mechanical operation and environmental resistance.

6.Precautions

■When inserting crimp-type (solderless) terminals to crimping (solderless) sockets, to maintain

reliable performance, please do not insert obliquely.

■DO NOT mate/un-mate non-terminated plugs with non-mounted receptacles.

This may lead to damage or deformation of the contacts.

■Removal of the holding electric cable may cause damage so please be careful.

■DO NOT apply flux to the contact terminals when hand soldering the receptacle to the board.

Wicking of the flux into the electrical contact areas may lead to connection failures.

■Slight discoloration on the insulating materials will not affect form, fit or function of the

connectors.

■Please refer to the documents "Cable assembly Procedure", "Crimp condition" and "Crimp

quality standards" for the cable assembly procedures.

■Please refer to the "Mating/Unmating Operation Instruction Manual" for the connector

operation.

BUsage Recommendations