©2015

DS-70005001D

01/15

16

2.4 GHz WLAN High-Gain, High-Efficiency FEM

SST12LF02

Data Sheet

Packaging Diagrams

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-14018A Sheet 1 of 1

16-Lead Extremely Thin Quad Flatpack No-Leads (QXCE/F) - 3x3 mm Body [XQFN]

16-xqfn-3x3-QXC-1.0

Note:

1.

Complies with JEDEC JEP95 MO-248, variant XEED-4 except external paddle nominal dimensions.

2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.

3. The external paddle is electrically connected to the die back-side and to VSS.

This paddle must be soldered to the PC board; it is requiresd to connect this paddle to the VSS of the unit.

Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of the device.

4. Untoleranced dimensions are nominal target dimensions.

5.

All linear dimensions are in millimeters (max/min).