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LAN8741A Datasheet(PDF) 99 Page - Microchip Technology

No. de pieza LAN8741A
Descripción Electrónicos  Small Footprint MII/RMII 10/100 Energy Efficient Ethernet Transceiver with HP Auto-MDIX and flexPWR짰 Technology
PDF  106 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

LAN8741A Datasheet(HTML) 99 Page - Microchip Technology

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 2013-2015 Microchip Technology Inc.
DS00001988A-page 99
LAN8741A/LAN8741Ai
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
3.40
3.40
MILLIMETERS
0.50 BSC
MIN
E
MAX
4.90
Contact Pad Length (X32)
Contact Pad Width (X32)
Y1
X1
0.85
0.30
Microchip Technology Drawing C04-2160C SQFN
NOM
32-Lead Very Thin Plastic Quad Flat, No Lead Package (MQ) - 5x5mm Body [VQFN]
SILK SCREEN
C1
Contact Pad Spacing
4.90
Contact Pad to Center Pad (X32)
G1
0.33
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
SMSC LEGACY SQFN
Contact Pad to Contactr Pad (X28)
G2
0.20
1
2
32
C1
C2
EV
EV
X2
Y2
E
X1
Y1
G1
G2
ØV



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