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PL610-01VC Datasheet(PDF) 7 Page - Microchip Technology |
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PL610-01VC Datasheet(HTML) 7 Page - Microchip Technology |
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7 / 16 page ![]() 2016 Microchip Technology Inc. DS20005616A-page 7 PL610-01/-02/-03 2.0 PAD DESCRIPTIONS The descriptions of the pads are listed in Table 2-2. Pad Configurations TABLE 2-1: DIE SPECIFICATION Chip Size Chip Thickness Pad Size Chip Base 0.65 mm x 0.60 mm Optional 90 µm GND Level TABLE 2-2: PAD FUNCTION TABLE Pad Number Pad Center Pad Name PL610-01 Pad Name PL610-02 Pad Name PL610-03 XY 1 –177 231 XIN XOUT XIN 2 –215 41 OE, PDB, CLK1 VDD GND 3 –215 –186 GND CLK0 CLK0 4 215 –186 CLK0 GND VDD 5 215 41 VDD OE, PDB, CLK1 OE, PDB, CLK1 6 177 213 XOUT XIN XOUT PL610-01 PL610-02 (650μmx600μm) 0.60 Note: ^ denotes internal pull up 1 XOUT VDD CLK0 XIN OE^, PDB^, CLK1 GND PL610-01 (Wire Bond) 2 3 6 5 4 X Y (650μmx600μm) 0.60 Note: ^ denotes internal pull up 1 XOUT VDD CLK0 XIN OE^, PDB^, CLK1 GND PL610-02 (Flip Chip) 2 3 6 5 4 X Y PL610-03 (650μmx600μm) Note: ^ denotes internal pull up 1 XIN GND CLK0 XOUT OE^, PDB^, CLK1 VDD PL610-03 2 3 6 5 4 X Y 0.60 |
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