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PL130-07OC-R Datasheet(PDF) 4 Page - Microchip Technology |
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PL130-07OC-R Datasheet(HTML) 4 Page - Microchip Technology |
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4 / 16 page ![]() PL130-07 DS20005598A-page 4 2016 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Storage Temperature Range TS –65 — +150 °C — Ambient Operating Temperature TA –40 — +85 °C Note 2 Junction Temperature TJ — — +125 °C — Lead Temperature — — — +260 °C Soldering, 10 seconds Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. 2: Operating Temperature is guaranteed by design for all parts (COMMERCIAL and INDUSTRIAL), but tested for COMMERCIAL grade only. |
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