TSB611ILT datasheet(17/24 Pages) STMICROELECTRONICS

17 / 24 page

TSB611

Application information

DocID028074 Rev 1

17/24

Equation 2

Where:

AFV is the voltage acceleration factor

β is the voltage acceleration constant in 1/V, constant technology parameter (β = 1)

VS is the stress voltage used for the accelerated test

VU is the voltage used for the application

The temperature acceleration is driven by the Arrhenius model, and is defined in

Equation 3.

Equation 3

Where:

AFT is the temperature acceleration factor

Ea is the activation energy of the technology based on the failure rate

k is the Boltzmann constant (8.6173 x 10

-5 eV.K-1)

TU is the temperature of the die when VU is used (K)

TS is the temperature of the die under temperature stress (K)

The final acceleration factor, AF, is the multiplication of the voltage acceleration factor and

the temperature acceleration factor (Equation 4).

Equation 4

AF is calculated using the temperature and voltage defined in the mission profile of the

product. The AF value can then be used in Equation 5 to calculate the number of months of

use equivalent to 1000 hours of reliable stress duration.

Equation 5

To evaluate the op amp reliability, a follower stress condition is used where VCC is defined

as a function of the maximum operating voltage and the absolute maximum rating

(as recommended by JEDEC rules).

The Vio drift (in µV) of the product after 1000 h of stress is tracked with parameters at

different measurement conditions (see Equation 6).

Equation 6

β V

–

------

–

Months

1000 h

12 months

24 h

365.25 days

maxV

op with Vicm

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