SAW FILTER

HDF433M SMD-4

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5-2 Resistance to solder heat

Submerge the device terminals into the solder bath at 260℃±5℃ for 10±1 sec.

Then release the device into the room conditions for 4 hours. It shall meet the specifications

in 2.2.

5-3 Solderability

Submerge the device terminals into the solder bath at 245℃±5℃ for 5s, More than

95% area of the soldering pad must be covered with new solder. It shall meet the

specifications in 2.2.

5-4 Mechanical shock

Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the

filter shall fulfill the specifications in 2.2.

5-5 Vibration

Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude

of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in 2.2.

6. REMARK

6.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction

of the component. Please avoid static voltage.

6.2 Ultrasonic cleaning

Ultrasonic vibration may cause deterioration & destruction of the component.

Please avoid ultrasonic cleaning

6.3 Soldering

Only leads of component may be soldered. Please avoid soldering another part of

component.

7. Packing

7.1 Dimensions

(1) Carrier Tape: Figure 1

(2) Reel: Figure 2

(3) The product shall be packed properly not to be damaged during transportation and storage.

7.2 Reeling Quantity

1000 pcs/reel

7’’

3000 pcs/reel

13’’

7.3 Taping Structure

(1) The tape shall be wound around the reel in the direction shown below.