2

HV9925

Ordering Information

Device

Package Option

8-Lead SOIC (w/Heat Slug)

4.90x3.90mm body

1.70mm height (max)

1.27mm pitch

HV9925

HV9925SG-G

-G indicates package is RoHS compliant (‘Green’)

Absolute Maximum Ratings

Sym

Parameter

Min

Typ

Max

Units Conditions

Parameter

Value

Supply voltage, V

DD

-0.3 to +10V

PWMD, R

-0.3 to +10V

Supply current, I

DD

+5mA

Operating ambient temperature range

-40°C to +85°C

Operating junction temperature range

-40°C to +125°C

Storage temperature range

-65°C to +150°C

Power dissipation @ 25°C

800mW**

All voltages referenced to GND pin.

**The power dissipation is given for the standard minimum pad without a heat

slug, and based on R

and case-to-ambient thermal resistance, where the latter is determined by

the user’s board design. The junction-to-ambient thermal resistance is R

R

2

pad of 1 oz copper.

V

DD

V

-

-

7.5

-

V

---

V

UVLO

V

-

4.8

-

-

V

---

ΔV

UVLO

V

-

-

200

-

mV ---

I

DD

Operating supply current

-

-

300

500

μA

V

Output (DRAIN)

V

BR

Breakdown voltage

*

475

-

-

V

---

V

DRAIN

V

-

20

-

-

V

---

R

ON

On-resistance

-

-

100

200

Ω

I

C

DRAIN

Output capacitance

#

-

1.0

5.0

pF

V

I

SAT

DRAIN saturation current

-

100

150

-

mA ---

Notes:

*

Denotes the specifications which apply over the full operating ambient temperature range of -40°C < T

# Denotes guaranteed by design.

Pin Configuration

8-Lead SOIC (SG)

(top view)

Heat slug is at ground potential.

Product Marking

8-Lead SOIC (SG)

Y = Year Sealed

WW = Week Sealed

L = Lot Number

= “Green” Packaging

YWW

H9925

L L L L

1

2

3

4

8

7

6

5

RSENSE

GND

PWMD

VDD

DRAIN

DRAIN

DRAIN

NC

Heat Slug