DA9053 datasheet(5/183 Pages) DIALOG

5 / 183 page

DA9053

Flexible High-Power System PMIC with 1.8 A

Switching USB Power Manager

Datasheet

Revision 2.1

31-Aug-2016

CFR0011-120-00

5 of 183

18.7 A1: ICH (and ICH_BAT Average) Measurement Mode .................................................... 145

18.8 A2: TBAT and Battery Temperature Warning nIRQ Measurement Mode ........................ 145

18.9 A4, A5, A6: Automatic Measurement and High/Low Threshold Warning nIRQ Mode ..... 145

18.10 A8: Automatic Measurement of Internal Temperature ...................................................... 145

18.11 A3, A9: Manual Measurement VBAT and VBBAT ............................................................ 145

18.12 Fixed Threshold Non-ADC Warning nIRQ Mode .............................................................. 146

18.13 A7: XY Touch Screen Interface ........................................................................................ 146

18.13.1

Features............................................................................................................. 146

18.14 Pen Down Detect .............................................................................................................. 146

18.15 TSI Scheduler ................................................................................................................... 147

18.16 Pen Pressure .................................................................................................................... 148

18.17 GP-ADC ............................................................................................................................ 149

19 TSI Control ................................................................................................................................. 154

20 RTC Calendar and Alarm .......................................................................................................... 157

21 Register Page 1 ......................................................................................................................... 160

22 Customer OTP ........................................................................................................................... 161

23 Register MAP ............................................................................................................................. 164

23.1 Overview ........................................................................................................................... 164

24 External Component Selection ................................................................................................ 169

24.1 Capacitor Selection ........................................................................................................... 169

24.2 Inductor Selection ............................................................................................................. 170

24.3 Resistors ........................................................................................................................... 171

24.4 External Pass Transistors and Schottky Diodes ............................................................... 171

24.5 Backup Battery.................................................................................................................. 171

24.6 Battery Pack Temperature Sensor (NTC)......................................................................... 172

24.7 Crystal ............................................................................................................................... 172

25 Layout Guidelines ..................................................................................................................... 173

25.1 General Recommendations .............................................................................................. 173

25.2 System Supply and Charger ............................................................................................. 173

25.3 LDOs and Switched Mode Supplies ................................................................................. 173

25.4 Crystal Oscillator ............................................................................................................... 174

25.5 Thermal Connection, Land Pad and Stencil Design ......................................................... 174

26 Definitions .................................................................................................................................. 175

26.1 Power Dissipation and Thermal Design............................................................................ 175

27 Regulator Parameters ............................................................................................................... 176

27.1 Dropout Voltage ................................................................................................................ 176

27.2 Power Supply Rejection .................................................................................................... 176

27.3 Line Regulation ................................................................................................................. 176

27.4 Load Regulation ................................................................................................................ 177

28 Dialog Semiconductor 7x7 DA9053 Reference Board Bill of Materials ............................... 178

28.1 Dialog Reference Board Component Identification for Bill of Materials ............................ 178

29 Package Information ................................................................................................................. 180

29.1 Package Outlines .............................................................................................................. 180

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