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FMBT2222AW Datasheet(PDF) 9 Page - Formosa MS

No. de pieza FMBT2222AW
Descripción Electrónicos  SMD NPN Transistor
PDF  10 Pages
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Fabricante Electrónico  FORMOSA [Formosa MS]
Página de inicio  http://www.formosams.com
Logo FORMOSA - Formosa MS

FMBT2222AW Datasheet(HTML) 9 Page - Formosa MS

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http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Formosa MS
FMBT2222AW
Document ID
Issued Date
Revised Date
Revision
Page.
Reel packing
SOT-323
3,000
4.0
30,000
183*183*123
178
382*262*387
240,000
9.5
PACKAGE
REEL SIZE
REEL
COMPONENT
SPACING
BOX
INNER
BOX
REEL
DIA,
CARTON
SIZE
CARTON
APPROX.
GROSS WEIGHT
(kg)
(pcs)
(m/m)
(m/m)
(m/m)
(pcs)
(m/m)
(pcs)
7"
Profile Feature
Soldering Condition
Average ramp-up rate(T to T )
<3
/sec
Preheat
-Temperature Min(Tsmin)
150
-Temperature Max(Tsmax)
200
-Time(min to max)(t )
60~120sec
Tsmax to T
-Ramp-upRate
<3
/sec
Time maintained above:
-Temperature(T )
217
-Time(t )
60~260sec
Peak Temperature(T )
255
0/ 5
Time within 5
of actual Peak
Temperature(t )
Ramp-down Rate
<6
/sec
Time 25
to Peak Temperature
<6minutes
LP
s
L
L
L
P
P
o
o
o
o
o
oo
o
o
o
C
C
C
C
C
C-
+
C
C
C
C
3.Reflow soldering
10~30sec
1.Storage environment: Temperature=5
~40
Humidity=55% 25%
2.Reflow soldering of surface-mount devices
±
oo
CC
Suggested thermal profiles for soldering processes
Critical Zone
TL to TP
Critical Zone
TL to TP
TL
Tsmax
Tsmin
Ramp-up
Tp
tS
Preheat
t25 C to Peak
o
Time
25
TL
TP
Ramp-down
DS-231133
2009/08/10
2010/03/10
B
10
SMD NPN Transistor



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