CC2650MODAMOHT datasheet(33/40 Pages) TI1

No. de pieza	CC2650MODAMOHT

Descripción Electrónicos	Low energy Wireless MCU Module

PDF	40 Pages

Scroll/Zoom	100%

Fabricante Electrónico	TI1 [Texas Instruments]

Página de inicio	http://www.ti.com

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33 / 40 page

CC2650MODA

www.ti.com

SWRS187A – AUGUST 2016 – REVISED AUGUST 2016

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Product Folder Links: CC2650MODA

Application, Implementation, and Layout

7.2

Layout

7.2.1

Layout Guidelines

Use the following guidelines to lay out the CC2650MODA device:

•

The module must be placed close to the edge of the PCB.

•

TI recommends leaving copper clearance on all PCB layers underneath the antenna area, as shown in

Figure 7-2 and Figure 7-3.

•

TI recommends using a generous amount of ground vias to stitch together the ground planes on

different layers. Several ground vias should be placed close to the exposed ground pads of the

module.

•

No external decoupling is required.

•

The reset line should have an external pullup resistor unless the line is actively driven. Placement of

this component is not critical.

•

TI recommends leaving a clearance in the top-side copper plane underneath the RF test pads.

Figure 7-2. Top Layer

Figure 7-3. Bottom Layer

CC2650MODAMOHT Datasheet(PDF) 33 Page - Texas Instruments