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MCP2221 Datasheet(PDF) 62 Page - Microchip Technology |
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MCP2221 Datasheet(HTML) 62 Page - Microchip Technology |
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62 / 80 page ![]() MCP2221 DS20005292B-page 62 2015 Microchip Technology Inc. TABLE 4-2: THERMAL CONSIDERATIONS Standard Operating Conditions (unless otherwise stated) Operating temperature: -40 C TA +85C (I-Temp) Param. No. Sym. Characteristic Typ. Units Conditions TH01 θJA Thermal Resistance Junction to Ambient 70 C/W 14-pin PDIP package 95.3 C/W 14-pin SOIC package 100 C/W 14-pin TSSOP package 45.7 C/W 16-pin QFN 4 x 4 mm package TH02 θJC Thermal Resistance Junction to Case 32 C/W 14-pin PDIP package 31 C/W 14-pin SOIC package 24.4 C/W 14-pin TSSOP package 6.3 C/W 16-pin QFN 4 x 4 mm package TH03 TJMAX Maximum Junction Temperature +150 C TH04 PD Power Dissipation — W PD = PINTERNAL +PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL =IDD xVDD(1) TH06 PI/O I/O Power Dissipation — W PI/O = (IOL xVOL)+ (IOH x(VDD –VOH)) TH07 PDER Derated Power — W PDER =PDMAX (TJ –TA)/θJA(2, 3) Note 1: IDD is the current to run the device alone without driving any load on the output pins. 2: TA = Ambient Temperature. 3: TJ = Junction Temperature. |
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