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BGS3 Datasheet(PDF) 1 Page - BeRex Corporation

No. de pieza BGS3
Descripción Electrónicos  30-4000 MHz SILICON GERMANIUM Gain Block
PDF  9 Pages
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Fabricante Electrónico  BEREX [BeRex Corporation]
Página de inicio  http://www.berex.com
Logo BEREX - BeRex Corporation

BGS3 Datasheet(HTML) 1 Page - BeRex Corporation

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1
Rev. E
BeRex
●website: www.berex.com
●email: sales@berex.com
Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
All other trademarks are the property of their respective owners. © 2015 BeRex
30-4000 MHz SILICON GERMANIUM Gain Block
BGS3
Single Fixed 3V supply
No Dropping Resistor Required
No matching circuit needed
Lead-free/Green/RoHS compliant SOT-363 package
Application: Driver Amplifier, Cellular, PCS, GSM,
UMTS, WCDMA, Wireless Data
BeRex’s BGS3 is a high SiGe HBT MMIC am-
plifier, internally matched to 50 Ohms with-
out the need for external components. De-
signed to run directly from a 3V supply. The
BGS3 is designed for high linearity 3V gain
block applications . It is packaged in a RoHS-
compliant with SOT-363 surface mount
package.
Product Description
Device Features
 Driver Amplifier
 Cellular, PCS, GSM, UMTS, WCDMA
Applications
Applications Circuit
*C1, C2, C3 =100 pF ± 5%; C4 = 1000 pF ± 5%; C5 = 10uF; **L1 = 56nH
1 Device performance _ measured on a BeRex evaluation board at 25°C, 50 Ω system.
2 OIP3 _ measured with two tones at an output of 0 dBm per tone separated by 1 MHz.
Typical Performance
1
Absolute Maximum Ratings
Min.
Typical
Max.
Unit
Bandwidth
50
4000
MHz
IC @ (Vc = 3V)
48
55
62
mA
VC
3.0
V
dG/dT
-0.006
dB/°C
RTH
130
°C/W
Parameter
Unit
Rating
Operating Case Temperature
°C
-40 to +85
Storage Temperature
°C
-55 to +155
Junction Temperature
°C
150
Operating Voltage
V
+3.3
Supply Current
mA
110
Input RF Power
dBm
12
Operation of this device above any of these parameters may result in permanent damage.
**less than 56nH improves RF performance at over 0.9GHz.
*820nH or higher value L1 improves RF performance at under
*Optimum value of L1 may vary with board design.
BGS3
L1
C1
C3
C4
RFin
RFout
C5
+3V
C2
*C1,C2=2000pF, L1=820nH for 50MHz application.
BS3
X
IN
GND
GND
OUT
GND
GND
Pin Description
RF IN
3
RF OUT
6
GND
1,2,4,5
Part Marking (X: Wafer number)
Application Circuit Values Example
Freq.
50~900MHz
900MHz ~ 3GHz
3GHz ~ 4GHz
C1/C2
2nF
100pF
10pF
L1
820nH
56nH
12nH
(1608 Chip Ind.)
Parameter
Frequency
Unit
70
900
1900
2450
3500
MHz
Gain
28
25.4
21.6
20
17.2
dB
S11
-17
-17
-17
-20
-14.5
dB
S22
-14
-14
-14
-16
-18.9
dB
OIP3
2
30.5
30.5
30.5
28.5
27.2
dBm
P1dB
16.7
17.4
16.9
16
14.5
dBm
Noise Figure
1.8
1.7
1.8
1.9
2
dB
*C1,C2=10pF, L1=12nH for 3.5GHz application.


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