MAX16122 datasheet(2/16 Pages) MAXIM

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(All pins referenced to GND)

VCC..........................................................................-0.3V to +6V

RESET, SRESET to GND

Open-Drain..............................................................-0.3V to +6V

Push-Pull .................................................. -0.3V to (VCC + 0.3V)

MR, MR1, MR2........................................................-0.3V to +6V

SEL..........................................................................-0.3V to +6V

Input/Output Current (all pins)............................................20mA

Continuous Power Dissipation (TA = +70°C) (Multilayer Board)

WLP (derate 10.5mW/°C above +70°C) ......................840mW

Operating Temperature Range......................... -40°C to +125°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Soldering Temperature (reflow).......................................+260°C

WLP

Junction-to-Ambient Thermal Resistance (θJA) ..........95°C/W

(Note 1)

(VCC = 1.6V to 5.5V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Operating Voltage Range

VCC

RESET state guaranteed for VCC ≥ 0.95V

1.6

5.5

VCC Undervoltage Lockout

VCCUVLO

1.25

1.55

VCC Supply Current

ICC

VCC = 5V, steady-state condition; MR,

MR1, MR2, RESET, and SRESET not

asserted

µA

Supply Current with Oscillator

Running

ICC2

VCC = 3V

µA

VCC Reset Threshold

VTH

VCC falling

-2.5%

VTH

+2.5%

VCC Reset Threshold Hysteresis

VHYST

Reset Threshold Tempco

ppm/°C

VCC to RESET Output Delay

VCC falling at 10mV/µs from

(VTH + 100mV) to (VTH - 100mV)

µs

Reset Timeout Period

tRP

See Table 2

-10

tRP

+10

Manual Reset Setup Delay

tSU

Internal timing (see Tables 1a, 1b, 1c)

-10

tSU

+10

Debounce Period

tDB

MAX16122–MAX16125

Dual Pushbutton Controllers in

Tiny 6-Bump WLP Package

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics

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