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GB20SHT12-CAL Datasheet(PDF) 3 Page - GeneSiC Semiconductor, Inc. |
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GB20SHT12-CAL Datasheet(HTML) 3 Page - GeneSiC Semiconductor, Inc. |
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3 / 5 page ![]() Die Datasheet GB20SHT12-CAL Feb 2015 http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-bare-die/ Pg3 of 4 Mechanical Parameters Die Dimensions 2.95 x 2.95 mm 2 Anode pad size 2.69 x 2.69 Die Area total / active 8.70/7.02 Die Thickness 360 µm Wafer Size 100 mm Flat Position 0 deg Die Frontside Passivation Polyimide Anode Pad Metallization 4000 nm Al Backside Cathode Metallization 400 nm Ni + 200 nm Au Die Attach Electrically conductive glue or solder Wire Bond Al ≤ 380 µm Reject ink dot size Φ ≥ 0.3 mm Recommended storage environment Store in original container, in dry nitrogen, < 6 months at an ambient temperature of 23 °C Chip Dimensions: DIE A [mm] 2.95 B [mm] 2.95 METAL C [mm] 2.69 D [mm] 2.69 WIRE BONDABLE E [mm] 2.65 F [mm] 2.65 |
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