HMC1055

Data Sheet

Rev. A | Page 10 of 10

OUTLINE DIMENSIONS

Figure 15. 8-Lead Lead Frame Chip Scale Package [LFCSP]

2 mm × 2 mm Body and 0.90 mm Package Height

(CP-8-26)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Range

MSL

Package Description

Package

Option

HMC1055LP2CE

−40°C to +85°C

MSL1

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-26

XXXX

1055

H

HMC1055LP2CETR

−40°C to +85°C

MSL1

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-26

XXXX

1055

H

EVAL01-HMC1055LP2C

Evaluation Board

1.25

1.20

1.15

0.40

0.35

0.30

TOP VIEW

SIDE VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

1.00

0.90

0.80

0.65

0.60

0.55

0.20 REF

0.35 BSC

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

2.05

2.00 SQ

1.95

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registered trademarks are the property of their respective owners.

D13718-0-2/16(A)