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HMC441LP3 Datasheet(PDF) 4 Page - Hittite Microwave Corporation

No. de pieza HMC441LP3
Descripción Electrónicos  GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 6.5 - 13.5 GHz
PDF  6 Pages
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Fabricante Electrónico  HITTITE [Hittite Microwave Corporation]
Página de inicio  http://www.hittite.com
Logo HITTITE - Hittite Microwave Corporation

HMC441LP3 Datasheet(HTML) 4 Page - Hittite Microwave Corporation

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MICROWAVE CORPORATION
8 - 207
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
8
HMC441LP3
GaAs PHEMT MMIC MEDIUM
POWER AMPLIFIER, 6.5 - 13.5 GHz
v01.0604
Outline Drawing
Absolute Maximum Ratings
Drain Bias Voltage (Vdd)
+6.0 Vdc
Gate Bias Voltage (Vgg1,Vgg2)
-8.0 to 0 Vdc
RF Input Power (RFin)(Vdd = +5.0 Vdc)
+20 dBm
Channel Temperature
150 °C
Continuous Pdiss (T = 85 °C)
(derate 10 mW/°C above 85 °C)
0.65 W
Thermal Resistance
(channel to ground paddle)
100 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Vdd (V)
Idd (mA)
+5.5
81
+5.0
80
+4.5
79
+3.3
72
+3.0
71
Note: Amplifier will operate over full voltage range shown above
NOTES:
1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY
3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB
LAND PATTERN.
Typical Supply Current vs. Vdd



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