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LP8556

SNVS871I – JULY 2012 – REVISED MARCH 2016

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Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Options....................................................... 3

6

Pin Configuration and Functions ......................... 4

7

Specifications......................................................... 6

7.1

Absolute Maximum Ratings ...................................... 6

7.2

ESD Ratings.............................................................. 6

7.3

Recommended Operating Conditions ....................... 6

7.4

Thermal Information .................................................. 6

7.5

Electrical Characteristics........................................... 7

7.6

Electrical Characteristics — Boost Converter .......... 8

7.7

Electrical Characteristics — LED Driver ................... 9

7.8

Electrical Characteristics — PWM Interface ............. 9

7.9

Electrical Characteristics — Logic Interface .......... 10

7.10

7.11

Typical Characteristics .......................................... 11

8

Detailed Description ............................................ 12

8.1

Overview ................................................................. 12

8.2

Functional Block Diagram ....................................... 12

8.3

Feature Description................................................. 13

8.4

Device Functional Modes........................................ 28

8.5

Programming........................................................... 28

8.6

Register Maps ......................................................... 32

9

Application and Implementation ........................ 45

9.1

Application Information............................................ 45

9.2

Typical Application ................................................. 47

10

Power Supply Recommendations ..................... 51

11

Layout................................................................... 51

11.1

Layout Guidelines ................................................. 51

11.2

Layout Examples................................................... 52

12

Device and Documentation Support ................. 54

12.1

Trademarks ........................................................... 54

12.2

Community Resources.......................................... 54

12.3

Electrostatic Discharge Caution ............................ 54

12.4

Glossary ................................................................ 54

13

Mechanical, Packaging, and Orderable

Information ........................................................... 54

4 Revision History

Changes from Revision H (December 2014) to Revision I

Page

•

Changed "25 mA" to "23 mA" - E00, E08 and E09 SQ rows, E09, E11 TME rows ............................................................... 3

•

Changed Handing Ratings table to ESD Ratings .................................................................................................................. 6

•

Added updated Thermal Information ..................................................................................................................................... 6

•

Changed "8" to "10" in PWMres row ...................................................................................................................................... 9

•

•

•

•

Changed "via EPROM" in Table 13 title to "With an External Resistor" ............................................................................. 46

•

Changes from Revision G (November 2013) to Revision H

Page

•

Added Pin Configuration and Functions section, Handling Ratings table, Feature Description section, Device

Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ................................................................................................................................................................................... 1

Changes from Revision E (August 2013) to Revision G

Page

•

Changed Description of "1=" for OCP row in Fault table, STATUS Register Section.......................................................... 34

•

Changed A7h values for E02, E03, E04, E06, E07, E09, E11 DSGBA EPROM Bit Explanations tables ........................... 36

•

Deleted E00, E01, E08, E10, E12, E13 columns and A8H row from 3 EPROM Bit Explanations table.............................. 36

•

Changed values for E00, E08, E09 WQFN EPROM Settings table..................................................................................... 37