VNI8200XP-32 datasheet(32/43 Pages) STMICROELECTRONICS

No. de pieza	VNI8200XP-32

Descripción Electrónicos	Octal high-side smart power solid-state relay with serial

PDF	43 Pages

Scroll/Zoom	100%

Fabricante Electrónico	STMICROELECTRONICS [STMicroelectronics]

Página de inicio	http://www.st.com

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32 / 43 page

Thermal management

VNI8200XP-32

32/43

DocID027849 Rev 3

Thermal management

The power dissipation in the IC is the main factor that sets the safe operating condition of

the device in the application. Therefore, it must be taken into account very carefully.

Heatsinking can be achieved using copper on the PCB with proper area and thickness. The

following image shows the junction-to-ambient thermal impedance values for the

PowerSSO-36 package.

Figure 13: PowerSSO-36 thermal impedance vs. time

For instance, three cases have been considered using a PowerSSO-36 packaged with

copper slug soldered on a 1.6 mm thickness FR4 board with dissipating footprint (copper

thickness of 70 µm):



single layer PCB with just IC footprint dissipating area



double layer PCB with footprint dissipating area on the top side and a 2 cm

dissipating layer on the bottom side through 15 via holes



double layer PCB with footprint dissipating area on the top side and an 8 cm

dissipating layer on the bottom side through 15 via holes

VNI8200XP-32 Datasheet(PDF) 32 Page - STMicroelectronics