SN74LVC1G19DBVT datasheet(5/29 Pages) TI1

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SN74LVC1G19

www.ti.com

SCES464G – JUNE 2003 – REVISED AUGUST 2015

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Operating

1.65

5.5

VCC

Supply voltage

Data retention only

1.5

VCC = 1.65 V to 1.95 V

0.65 × VCC

VCC = 2.3 V to 2.7 V

1.7

VIH

High-level input voltage

VCC = 3 V to 3.6 V

VCC = 4.5 V to 5.5 V

0.7 × VCC

VCC = 1.65 V to 1.95 V

0.35 × VCC

VCC = 2.3 V to 2.7 V

0.7

VIL

Low-level input voltage

VCC = 3 V to 3.6 V

0.8

VCC = 4.5 V to 5.5 V

0.3 × VCC

Input voltage

5.5

Output voltage

VCC

VCC = 1.65 V

–4

VCC = 2.3 V

–8

IOH

High-level output current

–16

VCC = 3 V

–24

VCC = 4.5 V

–32

VCC = 1.65 V

VCC = 2.3 V

IOL

Low-level output current

VCC = 3 V

VCC = 4.5 V

VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V

Δt/Δv

Input transition rise or fall rate

VCC = 3.3 V ± 0.3 V

ns/V

VCC = 5 V ± 0.5 V

Operating free-air temperature

–40

°C

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

SN74LVC1G19

DBV (SOT-

DCK (SC70)

DRL (SOT)

DRY (SON)

YZP

THERMAL METRIC(1)

UNIT

23)

(DSBGA)

6 PINS

RθJA

Junction-to-ambient thermal resistance

165

259

142

234

123

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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