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LSM6DS3H Datasheet(PDF) 99 Page - STMicroelectronics |
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LSM6DS3H Datasheet(HTML) 99 Page - STMicroelectronics |
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99 / 104 page ![]() DocID028370 Rev 4 99/104 LSM6DS3H Soldering information 104 12 Soldering information The LGA package is compliant with the ECOPACK®, RoHS and "Green" standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Leave "Pin 1 Indicator" unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com/mems. |
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