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TLV2553 Datasheet(PDF) 5 Page - Texas Instruments

No. de pieza TLV2553
Descripción Electrónicos  11-Channel, Low-Power, Serial ADC
PDF  36 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TLV2553 Datasheet(HTML) 5 Page - Texas Instruments

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TLV2553
www.ti.com
SLAS354C – SEPTEMBER 2001 – REVISED SEPTEMBER 2015
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2.7
5.5
V
16-bit I/O
0.01
15
VCC = 4.5 V to 5.5 V 12-bit I/O
0.01
15
I/O CLOCK frequency
MHz
8-bit I/O
0.01
15
VCC = 2.7 V to 3.6 V
0.01
10
I/O
Tolerable clock jitter
VCC = 4.5 V to 5.5 V
0.38
ns
CLOCK
Aperature jitter
VCC = 4.5 V to 5.5 V
100
ps
VCC = 4.5 V to 5.5 V
0
(REF+ ) – (REF– )
Analog input voltage(1)
VCC = 3 V to 3.6 V
0
(REF+ ) – (REF– )
V
VCC = 2.7 V to 3 V
0
(REF+ ) – (REF– )
VCC = 4.5 V to 5.5 V
2
VIH
High-level control input voltage
V
VCC = 2.7 V to 3.6 V
2.1
VCC = 4.5 V to 5.5 V
0.8
VIL
Low-level control input voltage
V
VCC = 2.7 V to 3.6 V
0.6
TA
Operating free-air temperature
TLV2553I
–40
85
°C
(1)
Analog input voltages greater than the voltage applied to REF+ convert as all ones (111111111111), while input voltages less than the
voltage applied to REF– convert as all zeros (000000000000).
6.4 Thermal Information
TLV2553
THERMAL METRIC(1)
DW (SOIC)
PW (TSSOP)
UNIT
20 PINS
20 PINS
RθJA
Junction-to-ambient thermal resistance
66
88.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
31.4
21.6
°C/W
RθJB
Junction-to-board thermal resistance
33.7
40.4
°C/W
ψJT
Junction-to-top characterization parameter
7.4
0.8
°C/W
ψJB
Junction-to-board characterization parameter
33.3
39.7
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2001–2015, Texas Instruments Incorporated
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