AS3649

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

www.ams.com/AS3649

1.0-2

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5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 5 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

VIN to GND

-0.3

+7.0

V

STROBE, TXMASK/TORCH, SCL, SDA, ON, NTC to

GND

-0.3

VIN + 0.3

V

max. +7V

SW1/2, VOUT1/2, LED_OUT1/2 to GND

-0.3

+7.0

V

VOUT1/2 to SW1/2

-0.3

V

Note: Diode between VOUT1/2 and SW1/2

voltage between AGND, PGND1/2 pins

0.0

0.0

V

short connection required

Input Pin Current without causing latchup

-100

+100

mA

Norm: EIA/JESD78

Continuous power dissipation

1470

mW

1

1. Depending on actual PCB layout and PCB used measured on demoboard; for peak power dissipation during flashing see document

'AS3649 Thermal Measurements'

Continuous power dissipation derating factor

20

mW/ºC

2

Electrostatic Discharge

ESD HBM

±2000

V

Norm: JEDEC JESD22-A114F

ESD CDM

±500

V

Norm: JEDEC JESD 22-C101E

Temperature Ranges and Storage Conditions

Junction to ambient thermal resistance

50

3

3. Measured on AS3649 demoboard.

ºC/W

For more information about thermal metrics, see

application note AN01 Thermal Characteristics

Junction Temperature

+150

ºC

Internally limited (overtemperature protection),

max. 20000s

Storage Temperature Range

-55

+125

ºC

Humidity

5

85

%

Non condensing

Body Temperature during Soldering

+260

ºC

according to IPC/JEDEC J-STD-020

Moisture Sensitivity Level (MSL)

MSL 1

Represents a max. floor life time of unlimited