MXP22-C datasheet(1/1 Pages) MICROSEMI

No. de pieza	MXP22-C

Descripción Electrónicos	Monolithic Photodiode Array-Chip

PDF	1 Pages

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Fabricante Electrónico	MICROSEMI [Microsemi Corporation]

Página de inicio	http://www.microsemi.com

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2830 S. Fairview St.

Santa Ana, CA 92704

PH: 714.979.8220

FAX: 714.557.5989

Data Sheet # MSC1338.PDF

Updated:June 1999

MXP22-C

Electrical Characteristic

s@ 25

oC

Features

•

Dielectrically Isolated Diodes

•

Aluminum Wire bondable

•

Backside Metallization - Gold

•

Die Attach methods: Eutectic or Epoxy

Monolithic Photodiode Array - Chip

SYMBOL

CHARACTERISTIC

CONDITIONS

MIN

TYP

MAX

UNITS

VOC

Open Circuit Voltage

10 mW/cm2, wavelength = 850 nm

10

Volts

ISC

Short Circuit Current

10 mW/cm2, wavelength = 850 nm

3.5

uA

VB

Reverse Breakdown Voltage

IR = 10 uA

20

Volts

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