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LC79451KB Datasheet(PDF) 30 Page - ON Semiconductor |
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LC79451KB Datasheet(HTML) 30 Page - ON Semiconductor |
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30 / 38 page ![]() LC79451KB No.A2223-30/38 9. PAD Assignment 9-1. PAD Assignment Fig.11. PAD Assignment Note: 1. Chip size (before dicing) X = 6.55 [mm] Y = 1.43 [mm] S = 9.37 [mm2] 2. Scribe line width 80 [ μm] 3. Chip thickness 400±30 [ μm] Bump shape (Bump height = 17±3 [ μm]) 68 μm 80 μm 60 μm 20 μm 40 μm 100 μm 50 μm Alignment mark (No bump) Fig.12. Gold bump shape Fig.13. Alignment mark shape Alignment mark 1 No. 1 No. 11 No. 12 No. 89 No. 90 No. 100 No. 101 No. 115 No. 154 No. 168 Alignment mark 2 X Y (0,0) SEG Driver pin The others pin |
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