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AR0134CSSC00SUEAH-GEVB Datasheet(PDF) 39 Page - ON Semiconductor |
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AR0134CSSC00SUEAH-GEVB Datasheet(HTML) 39 Page - ON Semiconductor |
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39 / 41 page ![]() Figure 26: 48-pin iLCC Package Drawing Notes: 1. Dimensions in mm. Dimensions in () are for reference only. Encapsulant: Epoxy. Substrate material: Plastic laminate 0.5 thickness. Lid material: Borosilicate glass 0.4 ± 0.04 thickness. Refractive index at 20C = 1.5255 @ 546nm and 1.5231 @ 588nm. Double side AR Coating: 530-570nm R< 1%; 420-700nm R < 2%. Lead finish: Gold plating, 0.5 microns minimum thickness. Image sensor die: 0.2mm thickness. Maximum rotation of optical area relative to package edges: 1°. Maximum tilt of optical area relative to substrate plane : 25 m. Maximum tilt of cover glass relative to optical area plane : 50 m. 2 3 4 5 6 7 D E |
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