TC622/TC624

DS21440B-page 8

© 2002 Microchip Technology Inc.

5.0

PACKAGING INFORMATION

5.1

Package Marking Information

Package marking data not available at this time.

5.2

Taping Form

5.3

Package Dimensions

Component Taping Orientation for 8-Pin SOIC (Narrow) Devices

Package

Carrier Width (W)

Pitch (P)

Part Per Full Reel

Reel Size

8-Pin SOIC (N)

12 mm

8 mm

2500

13 in

Carrier Tape, Number of Components Per Reel and Reel Size

Standard Reel Component Orientation

for TR Suffix Device

PIN 1

User Direction of Feed

P

W

3

° MIN.

PIN 1

.260 (6.60)

.240 (6.10)

.045 (1.14)

.030 (0.76)

.070 (1.78)

.040 (1.02)

.400 (10.16)

.348 (8.84)

.200 (5.08)

.140 (3.56)

.150 (3.81)

.115 (2.92)

.110 (2.79)

.090 (2.29)

.022 (0.56)

.015 (0.38)

.040 (1.02)

.020 (0.51)

.015 (0.38)

.008 (0.20)

.310 (7.87)

.290 (7.37)

.400 (10.16)

.310 (7.87)

8-Pin Plastic DIP

Dimensions: inches (mm)