RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS131023

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

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RFHA1101

Package Drawing (Dimensions in millimeters)

Bias Instruction for RFHA1101 Die

ESD Sensitive Material. Please use proper ESD precautions when handling devices die.

Die must be mounted with minimal die attach voids for proper thermal dissipation. This device is a depletion mode HEMT and

must have gate voltage applied for pinched off prior to applying drain voltage.

1.

Mount device on carrier or package with minimal die attach voiding and applying proper heat removal techniques.

2.

Connect ground to the ground supply terminal, and ensure that both the VG and VD grounds are also connected to this

ground terminal.

3.

Apply -4V to VG.

4.

Apply 28V to VD.

5.

6.

Turn on the RF input.