n North America: Tel. (800) 366-2266, Fax (800) 618-8883

n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298

n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020

Specifications subject to change without notice.

Visit www.macom.com for additional data sheets and product information.

V 2.0

Handling Procedures

All semiconductor chips should be handled with care to avoid

damage or contamination from perspiration and skin oils. The

use of plastic tipped tweezers or vacuum pickups is strongly

recommended for individual components. Bulk handling should

insure that abrasion and mechanical shock are minimized.

ESD

These devices very susceptible to ESD and are rated Class 0

(0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF

ESD, they must be handled in a static-free environment.

Bonding Techniques

Attachment to a circuit board is made simple through the use of

surface mount technology.

Mounting pads are conveniently

located on the bottom surface of these diodes and are removed

from the active junction locations. These diodes are well suited

for solder attachment onto hard and soft substrates. The use of

80/20 Au/Sn and 60/40 Sn/Pb solder is recommended.

Conductive epoxy paste for attachment may also be used, this

can be silk-screened, or used with a conductive sheet apoxy.

When soldering these diodes to a hard substrate, hot gas die

bonding is preferred. We recommend utilizing a vacuum tip and

a force of 60 to 100 grams applied normal to the top surface of

the part. When soldering to soft substrates, it is recommended

to use a lead-tin interface at the circuit board mounting pads.

Position the die so that its mounting pads are aligned with the

circuit board’s mounting pads Reflow the solder by heating the

circuit trace near the mounting pad while applying 60 to 100

grams of force perpendicular to the top surface of the die.

Since the HMIC™ glass is transparent, the edges of the

mounting pads closest to each other can be visually inspected

through the die after attach is completed.

Surface Mount Monolithic PIN Diode Chip

MA4SPS302 SurMount

™

™ Series

Electrical Specifications @ +25°C

Symbol

Test Conditions

Units

Min.

Typ.

Max.

-40 Volts, 1 MHz

1

pF

0.400

0.450

-40 Volts, 1 GHz

1, 3

pF

0.300

10 mA, 100 MHz

2,

Ω

1.0

10 mA, 1 GHz

2, 3

Ω

1.3

10 mA

V

0.84

1.00

10

µA

V

-70

-120

-70V

µA

10

10 mA / 6 mA

ns

460

Functional Schematic

1

Rp

Cp

Ls

Rvia

Rvia

+

-

1. Rs = 2 * Rvia + Rp

2