| Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
LT1769IGN Datasheet(PDF) 14 Page - Linear Technology |
|
|
|||||||||||||||||||||||||||||
LT1769IGN Datasheet(HTML) 14 Page - Linear Technology |
|
14 / 16 page ![]() 14 LT1769 APPLICATIONS INFORMATION Figure 11. Replacing the Input Diode CHARGE CURRENT (A) 0 40 50 2 1769 F09 30 20 0.5 1 1.5 70 60 NOTE: PEAK DIE TEMPERATURE WILL BE ABOUT 15 °C HIGHER AT 2A CHARGE CURRENT VIN = 19V VBAT = 12.3V VBOOST = 5V 2-LAYER BOARD ROOM TEMP = 24 °C 5 IN2 BOARD 25 IN2 BOARD BOARD AREA (IN 2) 0 45 40 35 30 25 20 15 10 15 25 1769 F08 510 20 30 35 MEASURED FROM AIR AMBIENT TO DIE USING COPPER LANDS AS SHOWN ON DATA SHEET 2-LAYER BOARD 4-LAYER BOARD Figure 8. LT1769 Thermal Resistance Figure 10. High Duty Cycle VIN SW BOOST SPIN SENSE BAT VCC VX 3V TO 6V CX 10 µF VBAT 1769 F11 C2 0.47 µF D2 D1 RX 50k Q2 Q1 LT1769 HIGH DUTY CYCLE CONNECTION Q1 = Si4435DY Q2 = TP0610L + + SW BOOST SPIN SENSE BAT VBAT C3 0.47 µF D2 LT1769 SW BOOST SPIN SENSE BAT VX 3V TO 6V CX 10 µF VBAT 1769 F10 C3 0.47 µF D2 LT1769 STANDARD CONNECTION HIGH DUTY CYCLE CONNECTION + + Battery voltage and input voltage will affect device power dissipation, so the data sheet power calculations must be used to extrapolate these readings to other situations. Vias should be used to connect board layers together. Planes under the charger area can be cut away from the rest of the board and connected with vias to form both a low thermal resistance system and to act as a ground plane for reduced EMI. Glue-on, chip-mounted heat sinks are effective only in moderate power applications where the PC board copper cannot be used, or where the board size is small. They offer very little improvement in a properly laid out multi- layer board of reasonable size. Higher Duty Cycle for the LT1769 Battery Charger Maximum duty cycle for the LT1769 is typically 90%, but this may be too low for some applications. For example, if an 18V ±3% adapter is used to charge ten NiMH cells, the charger must put out approximaly 15V. A total of 1.6V is lost in the input diode, switch resistance, inductor resis- tance and parasitics, so the required duty cycle is 15/16.4 = 91.4%. The duty cycle can be extended to 93% by restricting boost voltage to 5V instead of using VBAT as is normally done. This lower boost voltage also reduces power dissipation in the LT1769, so it is a win-win deci- sion. Connect an external source of 3V to 6V at VX node in Figure 10 with a 10 µF CX bypass capacitor. Figure 9. LT1769 Lead Temperature |
|
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |