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AN3232 Datasheet(PDF) 5 Page - STMicroelectronics |
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AN3232 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 26 page ![]() AN3232 Epoxy sealed, non-hermetic RF power packages Doc ID 17594 Rev 3 5/26 1 Epoxy sealed, non-hermetic RF power packages Epoxy sealed products, such as the STAC package family, should be received in an N2- backfilled, vacuum-sealed ESD bag containing a desiccant. This decreases the possibility of moisture uptake by the package materials during transit and long-term storage. STAC packages carry a moisture sensitivity rating of 3 (MSL3), but have demonstrated capabilities of up to MSL1. Even with such shipping methods, it is advised to store epoxy sealed packages in the original containers, or in a dry box, until required for soldering. When the environmental history of devices is not well-known, such as after a prolonged storage period, it is a well- practiced safety measure to bake non-hermetic packages for 24 hrs at 125 °C prior to soldering operations. These conditions can be accelerated or lengthened as a function of temperature, up to the limits imposed by shipping containers, by trays, or by device maximum ratings. Refer to Figure 2 for recommended baking conditions. Figure 2. Drying times Under no circumstances should any epoxy-sealed package be treated as a hermetically sealed package, due to the fact that such sealing materials are not impervious to moisture ingress. However, it is important to point out that RF Power packages are typically constructed using engineering ceramics and polymers which, on their own, demonstrate high resistance to moisture penetration, such as the proprietary liquid crystal polymer materials upon which STAC packages are realized. |
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