AN2836 datasheet(35/57 Pages) STMICROELECTRONICS

35 / 57 page

AN2836

Designing an application with L6225, L6226, L6227

Doc ID 15084 Rev 1

35/57

Figure 39.

Maximum output current vs. selectable devices

4.16.2

Power dissipation and thermal analysis with PractiSPINTM software

The PractiSPINTM software includes a power dissipation and thermal analysis section that

helps in calculating the IC power dissipation and estimating its junction temperature, through

a simulation.

This section is intended to help to give a fast evaluation of the device, package and

dissipating copper area required by the user’s application, and to be a good starting point for

designing an application (from the power dissipation and thermal point of view). Software

results, especially thermal results, need to be confirmed on the bench.

The input data for simulation are divided in three sections:

Application data: to select the motor characteristics and its configuration, the

driving parameters and the analysis type (steady state, single pulse or repeated

pulse analysis).

Device data: to choose the device part number and to edit some available IC

parameters.

PCB data: to select the package, the PCB dissipating charcteristics and ambient

temperature.

The output data include the waveforms of temperature and current profile, the estimated IC

power dissipation and junction temperature.

For more details on the formulas used in the software, please refer to the "Help" menu of

“Power Dissipation and Thermal Analysis”.

AN2836 Datasheet(PDF) 35 Page - STMicroelectronics