21/24

XC6505

Series

■

PACKAGING INFORMATION (Continued)

●

SOT-25 Power Dissipation

Board Mount (Tj max = 125℃)

Ambient Temperature（℃）

Power Dissipation Pd（mW）

Thermal Resistance (℃/W)

25

600

105

120

166.67

評価基板レイアウト（単位：mm）

Power dissipation data for the SOT-25 is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as one of reference data taken in the described condition.

1.

Measurement Condition (Reference data)

Condition:

Mount on a board

Ambient:

Natural convection

Soldering:

Lead (Pb) free

2

Board:

Dimensions 40 x 40 mm (1600 mm in one side)

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

(Board of SOT-26 is used.)

Material:

Glass Epoxy (FR-4)

Thickness:

1.6 mm

Through-hole: 4 x 0.8 Diameter

Evaluation Board (Unit: mm)

2. Power Dissipation vs. Ambient Temperature

Pd-Ta特性グラフ

0

100

200

300

400

500

600

700

25

45

65

85

105

125

周囲温度Ta（℃）

Pd vs. Ta

Ambient Temperature Ta (℃)