Data Sheet P11998EJ3V0DS00

21

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

Please consult with our sales officers in case other soldering process is used or in case soldering is done under

different conditions.

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

µµµµPC2798GR

Soldering process

Soldering conditions

Symbol

Infrared ray reflow

Peak package’s surface temperature: 235

°C or below,

Reflow time: 30 seconds or below (210

°C or higher),

Number of reflow process: 3, Exposure limit

IR35-00-3

VPS

Peak package’s surface temperature: 215

°C or below,

Reflow time: 40 seconds or below (200

°C or higher),

Number of reflow process: 3, Exposure limit

VP15-00-3

Partial heating method

Terminal temperature: 300

°C or below,

Flow time: 3 seconds or below,

Exposure limit

Note

Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25

°C and relative humidity at 65% or less.

Caution Do not apply more than single process at once, except for “Partial heating method”.