 |
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
|
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
UPC1857ACT Datasheet(PDF) 40 Page - NEC |
|
|
|||||||||||||||||||||||||||||
UPC1857ACT Datasheet(HTML) 40 Page - NEC |
|
|
40 / 44 page  40 µµµµPC1857A 8. RECOMMENDED SOLDERING CONDITIONS It is recommended to solder this product under the conditions described below. For details of the recommended soldering conditions, refer to the Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended, consult NEC. Soldering condition of through-hole type µµµµPC1857ACT: 30-pin plastic shrink DIP (400 mil) Soldering Method Soldering Condition Wave soldering (only pins) Soldering bath temperature: 260 °C MAX., Time: 10 seconds Partial heating Pin temperature: 300 °C MAX., Time: 3 seconds MAX. (per pin) Caution Apply wave soldering only to the pins, and exercise care that solder does not directly contact the package. |
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Spanish ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
