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HCS193KMSR Datasheet(PDF) 9 Page - Intersil Corporation |
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HCS193KMSR Datasheet(HTML) 9 Page - Intersil Corporation |
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9 / 9 page ![]() 278 HCS193MS Die Characteristics DIE DIMENSIONS: 104 x 86 mils 2642 µm x 2185µm METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCS193MS P1 (1) Q1 (2) Q0(3) GND (8) P3 (9) (15) P0 VCC (16) P2 (10) CPD(4) CPU(5) Q2(6) Q3(7) (14) MR (13) TCD (12) TCU (11) PL Spec Number 518759 |
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