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HCS157MS Datasheet(PDF) 9 Page - Intersil Corporation |
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HCS157MS Datasheet(HTML) 9 Page - Intersil Corporation |
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9 / 9 page ![]() 181 HCS157MS Die Characteristics DIE DIMENSIONS: 84 x 84 mils METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCS157MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS157 is TA14371A. (14) 4I0 (13) 4I1 (12) 4Y (11) 3I0 (10) 3I1 1I1 (3) 1Y (4) 2I0 (5) 2I1 (6) Spec Number 518833 |
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