FT231XQ-R datasheet(40/45 Pages) FTDI

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FT231X USB TO FULL HANDSHAKE UART IC

Datasheet

Version 1.2

Document No.: FT_000565 Clearance No.:

FTDI# 261

9.5 Solder Reflow Profile

The FT231X is supplied in Pb free 20 LD SSOP and QFN-20 packages. The recommended solder reflow

profile for both package options is shown in Figure 9.5.

Figure 9.5 FT231X Solder Reflow Profile

The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both

a completely Pb free solder process (i.e. the FT231X is used with Pb free solder), and for a non-Pb free

solder process (i.e. the FT231X is used with non-Pb free solder).

Profile Feature

Pb Free Solder Process

Non-Pb Free Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical Temperature

TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

240°C

Time within 5°C of actual Peak Temperature

(tp)

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature, Tp

8 minutes Max.

6 minutes Max.

Table 9.1 Reflow Profile Parameter Values

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

FT231XQ-R Datasheet(PDF) 40 Page - Future Technology Devices International Ltd.

FT231XQ-R Datasheet(HTML) 40 Page - Future Technology Devices International Ltd.

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