MBRF3060CTP datasheet(5/7 Pages) SMC

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SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N0125, Rev. A

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

MBRF3060CTP

Electrical Characteristics:

Characteristics

Symbol

Condition

Max.

Units

VF1

@ 15A, Pulse, TJ = 25 °C

0.77

Max. Forward Voltage Drop

(per leg)*

VF2

@ 15 A, Pulse, TJ = 125 °C

0.67

Max. Reverse Current (per

leg)*

IR1

@VR = rated VR

TJ = 25

°C

1.0

IR2

@VR = rated VR

TJ = 125 °C

100

Max. Junction Capacitance

(per leg)

@VR = 5V, TC = 25 °C

fSIG = 1MHz

700

Max. Voltage Rate of Change

dv/dt

10,000

µs

Clip mounting, the epoxy body

away from the heatsink edge by

more than 0.110" along the lead

direction.

4500

Clip mounting, the epoxy body is

inside the heatsink.

3500

RSM Isolation Voltage

(t = 1.0 second, R. H. < =30%,

TA = 25 °C)

VISO

Screw mounting, the epoxy body

is inside the heatsink.

1500

* Pulse Width < 300µs, Duty Cycle <2%

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Max. Junction Temperature

-55 to +150

°C

Max. Storage Temperature

Tstg

-55 to +150

°C

Maximum Thermal

Resistance Junction to Case

RθJC

DC operation

3.0

°C/W

Maximum Thermal

Resistance, Case to Heat

Sink

RθJA

DC operation

°C/W

Approximate Weight

Case Style

ITO-220AB

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