| Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
MAX17543 Datasheet(PDF) 16 Page - Maxim Integrated Products |
|
|
|||||||||||||||||||||||||||||
MAX17543 Datasheet(HTML) 16 Page - Maxim Integrated Products |
|
16 / 19 page ![]() The junction temperature of the device can be estimated at any given maximum ambient temperature (TA_MAX) from the equation below: ( ) = + θ × J_MAX A_MAX JA LOSS TT P If the application has a thermal management system that ensures that the exposed pad of the device is maintained at a given temperature (TEP_MAX) by using proper heatsinks, then the junction temperature of the device can be estimated at any given maximum ambient temperature from the equation below: ( ) = + θ × J_MAX EP_MAX JC LOSS TT P PCB Layout Guidelines All connections carrying pulsed currents must be very short and as wide as possible. The inductance of these connections must be kept to an absolute minimum due to the high di/dt of the currents. Since inductance of a current carrying loop is proportional to the area enclosed by the loop, if the loop area is made very small, inductance is reduced. Additionally, small-current loop areas reduce radiated EMI. A ceramic input filter capacitor should be placed close to the VIN pins of the IC. This eliminates as much trace inductance effects as possible and gives the IC a cleaner voltage supply. A bypass capacitor for the VCC pin also should be placed close to the pin to reduce effects of trace impedance. When routing the circuitry around the IC, the analog small-signal ground and the power ground for switching currents must be kept separate. They should be connected together at a point where switching activity is at a minimum, typically the return terminal of the VCC bypass capacitor. This helps keep the analog ground quiet. The ground plane should be kept continuous/unbroken as far as possible. No trace carrying high switching current should be placed directly over any ground plane discontinuity. PCB layout also affects the thermal performance of the design. A number of thermal vias that connect to a large ground plane should be provided under the exposed pad of the part, for efficient heat dissipation. For a sample layout that ensures first pass success, refer to the MAX17543 evaluation kit layout available at www.maximintegrated.com. MAX17543 4.5V–42V, 2.5A, High-Efficiency, Synchronous Step-Down DC-DC Converter with Internal Compensation www.maximintegrated.com Maxim Integrated │ 16 |
|
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |