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STCD2400F35F Datasheet(PDF) 31 Page - STMicroelectronics |
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STCD2400F35F Datasheet(HTML) 31 Page - STMicroelectronics |
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31 / 39 page ![]() STCD22x0, STCD23x0, STCD24x0 Package mechanical data Doc ID 15400 Rev 2 31/39 8 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 25. Flip Chip 12-bump, package mechanical outline 7504892_L(E) |
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