MMIC

AP249

Korean Facilities : 82-31-250-5078 / rfsales@rfhic.com

All specifications may change without notice

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Version 5.4

Package Dimensions (Type: SOIC-8)

* Unit: mm[inch] | Tolerance ±0.2[.008]

Pin Description

Pin No

Function

Pin No

Function

1

RF IN(2)

5

RF OUT(1)

2

GND

6

GND

3

GND

7

GND

4

RF IN(1)

8

RF OUT(2)

Recommended Pattern

Mounting Configuration Notes

1. Ground / thermal via holes are critical for the proper

performance of this device.

2. Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the

board to a heat sink. Ensure that the ground / thermal via

hole region contacts the heat sink.

4. Do not put solder mask on the backside of the PCB in the

region where the board contacts the heat sink.

5. RF trace width depends upon the PCB material and

construction.

6. Use 1 oz. Copper minimum.