• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

1

GaAs SPST Switch

DC - 6.0 GHz

Rev. V5

MASW6020G

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Features

 Low Insertion Loss, 0.6 dB Typical @ 1.0 GHz

 Fast Switching Speed, 10 ns Typical

 Ultra Low DC Power Consumption

 Integral Static Protection

 100% Matte Tin Plating over Copper

 Halogen-Free “Green” Mold Compound

 RoHS* Compliant

Description

The MASW6020G is a GaAs MMIC SPST switch

die. This die is ideally used where low power

consumption is required.

Typical

applications

include

transmit

/

receive

switching, switch matrices and switched filter banks,

WLAN IEEE 802.11a and 802.11 b/g systems.

Other applications include cordless phones and

base stations.

Ordering Information

Part Number

Package

MASW6020G

DIE

1

Bond Pad Dimensions

Pad Layout

Control Value (A/B)

-8.5 VDC

Max Input RF Power

+34 dBm

(500 MHz - 4 GHz)

Storage Temperature

-65°C to +175°C

Operating Temperature

+175°C

Parameter

Absolute Maximum

Absolute Maximum Rating

2,3

2. Exceeding any one or combination of these limits may cause

permanent damage to this device.

3. M/A-COM Technology Solutions does not recommend

sustained operation near these survivability limits.

Bond Pad

Dimensions - Inches (mm)

RF1, RF2

0.004 x 0.008 (0.100 x 0.200)

Alt RF

0.004 x 0.005 (0.100 x 0.125)

A, B

0.004 x 0.004 (0.100 x 0.100)

GND1

0.012 x 0.007 (0.300 x 0.175)

GND2

0.009 x 0.008 (0.225 x 0.200)

Term

0.004 x 0.008 (0.100 x 0.200)

Schematic

Die Size - Inches (mm)

0.05 x 0.03 x 0.004 (1.270 x 0.770 x 0.250)

*Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.

1. Die quantity varies.