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AD9524/PCBZ Datasheet(PDF) 38 Page - Analog Devices |
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AD9524/PCBZ Datasheet(HTML) 38 Page - Analog Devices |
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38 / 56 page ![]() AD9524 Data Sheet Rev. E | Page 38 of 56 The second step is to multiply the power dissipated by the thermal impedance to determine the maximum power gradient. For this example, a thermal impedance of θJA = 20.1°C/W was used. Example 1 (703 mW × 20.1°C/W) = 14.1°C With an ambient temperature of 85°C, the junction temperature is TJ = 85°C + 14.1°C = 99°C This junction temperature is below the maximum allowable. Example 2 (1223 mW × 20.1°C/W) = 24.6°C With an ambient temperature of 85°C, the junction temperature is TJ = 85°C + 24.6°C = 109°C This junction temperature is below the maximum allowable. THERMALLY ENHANCED PACKAGE MOUNTING GUIDELINES Refer to the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP), for more information about mounting devices with an exposed paddle. |
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