TSL1402R

256 × 1 LINEAR SENSOR ARRAY WITH HOLD

TAOS041G − NOVEMBER 2011

12

r

r

Copyright

E 2011, TAOS Inc.

The LUMENOLOGY

r Company

www.taosinc.com

MECHANICAL INFORMATION

This assembly consists of 2 sensor chips mounted on a printed-circuit board in a clear molded plastic package.

Top of Die to

Top of Package

1

2

3

4

567

14

13

12

11

10

9

8

TOP VIEW

SIDE VIEW

BOTTOM

VIEW

14

14

0.406

END VIEW

1.90

0.76

7.87

7.37

2

1.42

0.89

1.29

14

0.00

3.18

2.79

0.53

0.28

Pin 1

Indicator

19.30

18.29

12

Nonaccumulative

See Note B

10.67

9.65

Sensors

C

L

3.62

3.92

Sensors

to Pin 1

Pixel 1

to Pin 1

NOTES: A. All linear dimensions are in millimeters.

B. The true-position spacing is 2.54 mm between lead centerlines. Each pin centerline is located within 0.25 mm of its true

longitudinal positions.

C. Index of refraction of clear plastic is 1.52.

D. The gap between the individual sensor dies in the array is 57

μm typical (51 μm minimum and 75 μm maximum).

E. This drawing is subject to change without notice.

Figure 11. Packaging Configuration