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IO96NDB2V1 Datasheet(PDF) 136 Page - Microsemi Corporation |
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IO96NDB2V1 Datasheet(HTML) 136 Page - Microsemi Corporation |
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136 / 242 page ![]() ProASIC3L DC and Switching Characteristics 2-120 Revision 13 1.2 V DC Core Voltage Table 2-199 • Output DDR Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V Parameter Description –1 Std. Units tDDROCLKQ Clock-to-Out of DDR for Output DDR 1.10 0.94 ns tDDRISUD1 Data_F Data Setup for Output DDR 0.59 0.50 ns tDDROSUD2 Data_R Data Setup for Output DDR 0.59 0.50 ns tDDROHD1 Data_F Data Hold for Output DDR 0.00 0.00 ns tDDROHD2 Data_R Data Hold for Output DDR 0.00 0.00 ns tDDROCLR2Q Asynchronous Clear-to-Out for Output DDR 1.26 1.07 ns tDDROREMCLR Asynchronous Clear Removal Time for Output DDR 0.00 0.00 ns tDDRORECCLR Asynchronous Clear Recovery Time for Output DDR 0.35 0.30 ns tDDROWCLR1 Asynchronous Clear Minimum Pulse Width for Output DDR 0.22 0.19 ns tDDROCKMPWH Clock Minimum Pulse Width High for the Output DDR 0.36 0.31 ns tDDROCKMPWL Clock Minimum Pulse Width Low for the Output DDR 0.32 0.28 ns FDDOMAX Maximum Frequency for the Output DDR 160.00 160.00 MHz Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-7 for derating values. |
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