MP2490DS datasheet(2/13 Pages) MPS

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MP2490 – 1.5A, 36V, 700KHz STEP-DOWN WITH PROGRAMMABLE OUTPUT CURRENT LIMIT

MP2490 Rev. 0.92

www.MonolithicPower.com

4/23/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

Free Air Temperature (TA)

MP2490DQ *

QFN10 (3mm X 3mm)

–40

°C to +85°C

MP2490DS

SOIC8

MP2490DS

–40

°C to +85°C

MP2490CP

PDIP8

MP2490CP

°C to +70°C

* For Tape & Reel, add suffix –Z (e.g. MP2490DQ–Z);

For RoHS, compliant packaging, add suffix –LF (e.g. MP2490DQ–LF–Z).

PACKAGE REFERENCE

TOP VIEW

VIN

GND

BST

PGOOD

ISP

ISN

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

VIN

GND

BST

ISP

ISN

TOP VIEW

QFN10 (3mm X 3mm)

SOIC/PDIP

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN ....................................... 40V

VSW....................................... –0.3V to VIN + 0.3V

VBST ................................................... VSW + 6.5V

VISN, vISP................................................0V to15V

All Other Pins..............................–0.3V to +6.5V

Continuous Power Dissipation (TA = +25°C)

(2)

QFN10 (3mm x 3mm) ................................ 2.5W

SOIC8 ...................................................... 1.39W

PDIP8 ...................................................... 1.32W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature.............. –65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................4.5V to 36V

Output Voltage VOUT (VIN>16.5V) ....... 0.8V to 15

Output Voltage VOUT (VIN<=16.5V) ......................

.........................................0.8V to (VIN–1.5)V

Operating Junction Temperature (TJ)

................................................ –40

°C to +125°C

Thermal Resistance

(4)

θJA

θJC

QFN10 (3mm x 3mm) .............50 ...... 12 ...

°C/W

SOIC8 .....................................90 ...... 45 ...

°C/W

PDIP8......................................95 ...... 55 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JEDEC51-7 4 layer PCB.

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