Copyright

© ANPEC Electronics Corp.

Rev. A.5 - Apr., 2009

APL3200

www.anpec.com.tw

2

Ordering and Marking Information

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Symbol

Parameter

Rating

Unit

DC, DCOK to GND

-0.3 ~ 20

V

DCLV, USB, BATT, UOK, PON, STAT1, STAT2, EN,

USEL to GND

-0.3 ~ 7

V

BYP to GND

-0.3 ~ 7

V

DCI, THRM, REF to GND

V

Continuous DCLV Input Current

1.6

A

Continuous USB Input Current

0.6

A

Maximum Junction Temperature

150

°C

Storage Temperature

-65 ~ 150

°C

Maximum Lead Soldering Temperature, 10 Seconds

260

°C

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance

(Note 2)

QFN5x5-16

TQFN4x4-16

40

°C/W

Recommended Operating Conditions

Symbol

Parameter

Range

Unit

DC Input Voltage (with OVP Protection)

4.35 ~ 18

V

DCLV Input Voltage (without OVP Protection)

4.35 ~ 6.0

V

USB Input Voltage

4.35 ~ 6.5

V

Note 2 :

θ

of QFN-16 is soldered directly on the PCB.

APL3200

Package Code

QA : QFN5x5-16

QB : TQFN4x4-16

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

Handling Code

Temperature Range

Package Code

APL3200 QA/QB:

APL3200

XXXXX

XXXXX - Date Code

Assembly Material