Milli-Cap

®

 

July 8, 2010

 

Dielectric Laboratories Inc.

2777 Route 20 East, Cazenovia, NY 13035

QUALITY SYSTEMS AS9100, ISO 9001 AND ENVIRONMENTAL SYSTEM ISO 14001 CERTIFIED

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Recommended Attachment Methods (Continued)

•

Recommended Attachment to Soft or Hard Substrate Using Solder:

Recommended Micro Strip Layout:

Attachment Method

1.

Place a single drop of solder paste onto each micro-strip as illustrated; the edge of the epoxy shall be at

least .001”- .002” back from the edge of the trace to prevent filling the gap with solder.

2.

Centering the termination gap of the capacitor within the gap in the micro strip, press with careful, even

pressure onto the micro strip ensuring the terminations make good contact with the drops of solder paste.

3.

Reflow according to the solder manufacturer’s preferred profile, ensuring the reflow temperature does not

exceed 250°C.

4.

After the reflow step is completed, inspect joint for voids or excess flux and non-reflowed solder balls that

can degrade performance or cause shorts across the gaps. Proper cleaning after the reflow process is

crucial to avoiding performance degradation and discovering poor solder joints.

Isopropanol, and Methanol are both safe to use with soldered Milli-Caps

Packaging

Packaging Options

Code

Description

Blank

Generic Waffle Pack

T

Tape and Reel, 7” Reel, 100pc Minimum, 5,000pc Maximum

(Consult with a sales representative for availability)

S

Distance from Trace Edge:

.001” - .002”

Ideal Micro Strip Width:

.020” - .025”

(.012” - .015” for P21)

Gap:

.015” - .020”

(.008” - .010” for P21)

Solder Diameter:

.020 - .025”

(.010” - .015” for P21)

Solder Thickness:

.004” - .006”