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MPC8358ECVVADDGA Datasheet(PDF) 95 Page - Freescale Semiconductor, Inc |
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MPC8358ECVVADDGA Datasheet(HTML) 95 Page - Freescale Semiconductor, Inc |
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95 / 102 page  MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5 Freescale Semiconductor 95 Heat Sink Attachment Millennium Electronics (MEI) 408-436-8770 Loroco Sites 671 East Brokaw Road San Jose, CA 95112 Internet: www.mei-millennium.com Tyco Electronics 800-522-6752 Chip Coolers™ P.O. Box 3668 Harrisburg, PA 17105-3668 Internet: www.chipcoolers.com Wakefield Engineering 603-635-5102 33 Bridge St. Pelham, NH 03076 Internet: www.wakefield.com Interface material vendors include the following: Chomerics, Inc. 781-935-4850 77 Dragon Ct. Woburn, MA 01888-4014 Internet: www.chomerics.com Dow-Corning Corporation 800-248-2481 Dow-Corning Electronic Materials 2200 W. Salzburg Rd. Midland, MI 48686-0997 Internet: www.dowcorning.com Shin-Etsu MicroSi, Inc. 888-642-7674 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com The Bergquist Company 800-347-4572 18930 West 78th St. Chanhassen, MN 55317 Internet: www.bergquistcompany.com 22.3 Heat Sink Attachment When attaching heat sinks to these devices, an interface material is required. The best method is to use thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint lifetime of the package. Recommended maximum force on the top of the package is 10 lb force (4.5 kg force). If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic surfaces and its performance verified under the application requirements. |
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